|
|
||
|
|
|||
|
FREE GlobalSpec e-Newsletters
Receive the latest news, trends, and technology relevant to your work. (See Titles) |
| All | Products & Services | Part Number Search |
Engineering News
|
Application Notes | Material Properties | Patents | Standards |
Welding machines and joining machines include all manner of devices used for welding, brazing and soldering.
Gas springs provide controlled motion and speed for elements, such as lids and doors, that open and close.
Search by Specification | Learn MorePigging systems and components are used to inspect, clean, or service a portion of piping without stopping the process flow.
Learn MoreStuds are mechanical fasteners which are threaded on one or both ends. One end is secured to an object. The other end is used typically with a nut
Search by Specification | Learn MoreLeveling feet and pads consist of discs of varying shapes and sizes. They are used for leveling jigs, fixtures, and equipment. A leveling foot has a threaded stud for adjusting the level. A leveling pad has a recess on which a leveling stud rests
Search by Specification | Learn MoreThin film materials are high purity materials and chemicals such as precursor gases, sputtering targets or evaporation filaments used to form or modify thin film deposits and substrates.
Learn MoreElectroceramics are ceramic materials that have been specially formulated for specific electrical, electro-magnetic, or optical properties. They include dielectric ceramics, electrostrictive ceramics, ferrite ceramics, garnets (ferromagnets), and piezoelectric ceramics.
Search by Specification | Learn MoreWire rope fittings includes clips, sleeves, stud ends, eyes, forks and other hardware used to construct mechanical cable assemblies
Learn MoreSnap fasteners or snaps are mechanical fasteners that close or lock with a clicking or snapping sound.
Learn MoreIndustrial ceramic materials are non-metallic, inorganic compounds that include oxides, carbides, or nitrides. They have high melting points, low wear resistance, and a wide range of electrical properties.
Search by Specification | Learn MoreSpecialty ceramics include nitrides, borides, carbon or graphite and silicides as well as other specialized non-metallic compounds.
Learn MoreNonferrous metals and alloys are not based on iron and include alloys of aluminum, copper, titanium, zinc, nickel, cobalt, tungsten, precious metals, refractory metals.
Learn MoreStainless steel alloys are austenitic, ferritic, martensitic, precipitation hardened (PH), and duplex metal materials that are available in a wide variety of grades, shapes, and sizes.
Search by Specification | Learn MoreSolders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together.
Search by Specification | Learn MoreCam followers or track rollers are rolling element bearings with either an integral stud or an inseparable inner ring for yoke mounting on a pin or shaft
Search by Specification | Learn More|
|
|||||
ESAB Multimaster® 300X ESAB Welding and Cutting Products
SonoWeld® and SpliceRite™ Ultrasonic Metal Welders Sonobond Ultrasonic Corp.
Mini-vert BUG-O Systems, Inc.
|
|
Flipchips: Tutorial 3, Stud Bump Flip Chip Stud bumping requires no under-bump metallization (UBM), and thus does not require wafer processing; individual die can be stud bumped as easily as |
|
|
Flipchips: Tutorial 24, Gold Stud Bump Applications often exploit the unique benefits of gold stud bump flip chips, and their advantages in many cases over the more common solder bump flip chips. |
|
|
Kulicke & Soffa : Products - Stud Bumpers - Wafer Stud Bumping... Home > Products > Stud Bumpers > Wafer Stud Bumping > Bump Specifications See Kulicke & Soffa Industries Information |
|
|
Kulicke & Soffa : Products - Stud Bumpers - Wafer Stud Bumping Stud bumping requires no under-bump metallization (UBM) and thus does not require wafer processing, so that individual die can be stud bumped as See Kulicke & Soffa Industries Information |
|
|
T&B Electrical World - Wed Sep 24 13:51:19 2008 Steel City® 4 inch Square Drawn Box with raised Ground Bump |
|
|
Step 2: Stud Bump Bonding Step 2: Stud Bump Bonding Magazine Title: Advanced Packaging Magazine Link: http://ap.pennnet.com |
|
|
High-power LED Stud-bump Packaging |
|
|
Stud bump socket |
|
|
Palomar Technologies formerly a Hughes Corporation Ball (Stud) Bump Wire Bonding Component Placement Model 8000 Ball (Stud) Bumper Component Placement Work Cells See Palomar Technological Companies Information |
|
|
Spiral chip inductors, CHIP SCALE LX5000Q20CSP-XXX - HIGH Q... INDUCTORS - GOLD STUD BUMP LX5000Q20CSP-L01-01nH - 1nH, 1 turn, 50x50 mils, HIGH Q FACTOR CHIP SCALE SPIRAL INDUCTORS GOLD STUD BUMP |